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目录列表（参考）：
│===半导体仿真论坛简介===.txt 343 bytes
│===请勿上传违法内容===.txt 602 bytes
├─ebook (0 folders, 14 files, 165.44 MB, 165.44 MB in total.)
│ANSYS高级工程有限元分析范例精选_电子工程篇.rar 4.10 MB
│[经典]ANSYS理论与应用_saeedMoaveni.rar 11.22 MB
│ANSYS工程应用教程——机械篇 (刘国庆 杨庆东) A.rar 15.91 MB
│ANSYS工程应用教程——热与电磁学篇.rar 21.05 MB
│ANSYS流体分析.rar 400.30 KB
│ANSYS融会与贯通 .rar 33.58 MB
│MSC.PATRAN使用指南.rar 4.83 MB
│电脑辅助工程分析：ANSYS使用指南.rar 6.22 MB
│流体力学有限元－哈工大－杨濯根.rar 2.93 MB
│实用工程数值模拟技术及其在ANSYS上的实践.rar 5.76 MB
│有限元基础与ANSYS入门.rar 16.38 MB
│有限元与ANSYS.rar 298.06 KB
│粘弹性力学基础.rar 2.11 MB
│最新经典 ANSYS[大型CAE书籍].rar 40.67 MB
├─pub (10 folders, 1 files, 313.50 KB, 544.41 MB in total.)
││Electrical Package Characterization.pdf 313.50 KB
│├─JEDEC标准 (2 folders, 1 files, 343.02 KB, 5.67 MB in total.)
│││fundamental of thermal performance.pdf 343.02 KB
││├─Failure Analysis (0 folders, 13 files, 2.53 MB, 2.53 MB in total.)
│││22b117.pdf 47.76 KB
│││jep134.pdf 123.50 KB
│││jep136.pdf 131.93 KB
│││JESD28-1.pdf 54.74 KB
│││jesd38.pdf 283.31 KB
│││jesd659a.pdf 80.19 KB
│││jesd671a.pdf 81.58 KB
│││JESD74.pdf 723.13 KB
│││JESD85.pdf 501.95 KB
│││JESD87.pdf 90.87 KB
│││jesd91a.pdf 293.78 KB
│││JESD94.pdf 157.78 KB
│││RN_jeb16.pdf 19.33 KB
││└─Thermal Test (0 folders, 12 files, 2.80 MB, 2.80 MB in total.)
││JESD51-10.pdf 102.64 KB
││jesd51-1.pdf 564.46 KB
││JESD51-11.pdf 211.93 KB
││jesd51-2.pdf 66.74 KB
││jesd51-3.pdf 334.67 KB
││jesd51-4.pdf 314.07 KB
││jesd51-5.pdf 56.35 KB
││jesd51-6.pdf 472.30 KB
││jesd51-7.pdf 308.68 KB
││jesd51-8.pdf 74.49 KB
││jesd51-9.pdf 213.09 KB
││jesd51.pdf 152.63 KB
│├─厂商文档 (0 folders, 3 files, 5.34 MB, 5.34 MB in total.)
││Device Package User Guide.rar 4.00 MB
││MOUNTING_OF_SURFACE_MOUNT_COMPONENTS-MISC.rar 917.94 KB
││Performance Characteristics of IC Packages.rar 457.68 KB
│├─电磁完整性 (0 folders, 20 files, 12.60 MB, 12.60 MB in total.)
││PCB design flow.pdf 96.41 KB
││linux_wireless_net_adm3-17.pdf 174.35 KB
││PCB板的EMC问题.pdf 201.26 KB
││TDR 阻抗测量-信号完整性的基础.pdf 1.72 MB
││超深亚微米芯片互连线电感提取技术及应用.pdf 149.54 KB
││存储器接口设计-认识信号完整性的价值.pdf 203.86 KB
││高速PCB设计指南.pdf 889.15 KB
││高速PCB设计中的串扰分析与控制.pdf 181.86 KB
││高速數位電路之電源完整性.pdf 140.14 KB
││高速背板总线的组合式匹配方法.pdf 171.02 KB
││高速数字系统印刷电路板的设计要点.pdf 200.16 KB
││基于GTL 技术的高速背板总线设计.pdf 198.84 KB
││基于信号完整性分析的高速数字PCB 的设计方法.pdf 16.49 KB
││数字设计人员验证信号完整性指南.pdf 3.81 MB
││无网格方法及其在电磁场数值计算中的应用.pdf 200.24 KB
││信号完整性.pdf 611.41 KB
││信号完整性分析.pdf 1.48 MB
││信号完整性和时序分析的模式变化.pdf 545.26 KB
││信号完整性与电源完整性的仿真分析与设计.pdf 741.47 KB
││用混合信号示波器调试嵌入式混合信号设计_3.pdf 0.98 MB
│├─封装材料 (1 folders, 18 files, 4.56 MB, 4.59 MB in total.)
│││0084-1LMISR4.pdf 311.15 KB
│││6600CS-Q_vs_CS-P.pdf 85.31 KB
│││DieAttachSoftSolders_0204.pdf 223.75 KB
│││EME-G700L.pdf 76.09 KB
│││FC-BGA CSP底层填充液体环氧封装材料.pdf 278.38 KB
│││G700series.PDF 382.25 KB
│││mat model.pdf 125.24 KB
│││material property used-2005-2-24.doc 36.50 KB
│││material property used.doc 36.50 KB
│││Physical Constants of IC Package Mat..pdf 100.98 KB
│││SMT reflow profile from J-STD-020.pdf 24.74 KB
│││Sumitomo G600.PDF 329.55 KB
│││TMA-0455-60136-CABGA-81-B.pdf 655.52 KB
│││半导体用环氧树脂封装胶粉.rar 10.67 KB
│││半导体用环氧树脂封装胶粉概况介绍.pdf 302.49 KB
│││高密度多層構裝基板與接合材料研究(III)-子計畫三-新型低介電係數材料之製備及.pdf 50.63 KB
│││碳奈米管環氧樹脂複合材料之製備及特性之研究.pdf 1.04 MB
│││電子用含萘環氧樹脂之合成及性質研究.pdf 579.35 KB
││└─mems_materials (0 folders, 44 files, 34.83 KB, 34.83 KB in total.)
││Ag_blk_ln.SI_MPL 897 bytes
││Al2O3_blk_ln.SI_MPL 1.26 KB
││Al_blk_ln.SI_MPL 1.13 KB
││Al_flm_ln.SI_MPL 732 bytes
││AlN_blk_ln.SI_MPL 978 bytes
││AlN_flm_ln.SI_MPL 514 bytes
││Au_blk_ln.SI_MPL 901 bytes
││C_Diamond_blk_ln.SI_MPL 636 bytes
││C_Diamond_flm_ln.SI_MPL 510 bytes
││Cu_blk_ln.SI_MPL 1.24 KB
││DLC_blk_ln.SI_MPL 655 bytes
││GaAs_blk_ln.SI_MPL 1.25 KB
││Mo_blk_ln.SI_MPL 1.06 KB
││Ni_blk_ln.SI_MPL 903 bytes
││Ni_flm_ln.SI_MPL 489 bytes
││Polyimide_flm_ln.SI_MPL 661 bytes
││PolySi_blk_ln.SI_MPL 475 bytes
││PolySi_flm_ln.SI_MPL 475 bytes
││Pt_blk_ln.SI_MPL 953 bytes
││Pt_flm_ln.SI_MPL 510 bytes
││Si3N4_blk_ln.SI_MPL 1.26 KB
││Si3N4_flm_ln.SI_MPL 681 bytes
││Si_blk_ln.SI_MPL 1.20 KB
││SiC_blk_ln.SI_MPL 1.28 KB
││SiC_flm_ln.SI_MPL 644 bytes
││SiO2_blk_ln.SI_MPL 992 bytes
││SiO2_flm_ln.SI_MPL 803 bytes
││Sn_blk_ln.SI_MPL 485 bytes
││StSteel_blk_ln.SI_MPL 874 bytes
││StSteel_flm_ln.SI_MPL 573 bytes
││Ta_blk_ln.SI_MPL 637 bytes
││Ti_blk_ln.SI_MPL 917 bytes
││Ti_flm_ln.SI_MPL 471 bytes
││TiC_blk_ln.SI_MPL 1.22 KB
││TiC_flm_ln.SI_MPL 512 bytes
││TiN_blk_ln.SI_MPL 877 bytes
││TiN_flm_ln.SI_MPL 680 bytes
││TiO2_blk_ln.SI_MPL 933 bytes
││W_blk_ln.SI_MPL 1.06 KB
││W_flm_ln.SI_MPL 514 bytes
││WC_blk_ln.SI_MPL 891 bytes
││Zn_blk_ln.SI_MPL 613 bytes
││ZnO_blk_ln.SI_MPL 508 bytes
││ZnO_flm_ln.SI_MPL 521 bytes
│├─封装基础 (0 folders, 37 files, 52.64 MB, 52.64 MB in total.)
││(2)微電子封裝基礎與設計.pdf 4.41 MB
││(3)微電子構裝可靠度設計 Charles Handout Oct 19.pdf 1.29 MB
││(4)先進構裝與晶圓級構裝基本原理 for 2004-1026 1102.pdf 3.67 MB
││(7)封裝實務與電路板組裝_Charles 2004 2005.pdf 3.30 MB
││5ch 电子封装技术发展趋势.rar 891.60 KB
││6ch IC封装材料发展趋势.rar 1.48 MB
││BGA封装的安装策略.rar 38.39 KB
││IC_组织显微检测方法.rar 932.95 KB
││IC封装术语.rar 11.13 KB
││IC與微系統構裝.pdf 5.97 MB
││MEMS-PME.rar 3.95 MB
││mems器件气密封装工艺规范（材料参数）.rar 360.61 KB
││PCB制造工艺综述.rar 179.37 KB
││SEMICONDUCTOR_PACKAGING_ASSEMBLY_TECHNOLOGY-MISC.rar 1.16 MB
││smt术语.rar 99.52 KB
││半導體封裝.pdf 4.20 MB
││半導體技術的奈米之路.pdf 374.86 KB
││薄膜成形技術新紀元.pdf 1.74 MB
││单元5 表面组装装技术基础.rar 462.81 KB
││倒装芯片工艺挑战SMT组装.rar 16.94 KB
││电子封装技术.rar 0.97 MB
││电子设备限制使用的六种有害物质的检测分析.rar 29.54 KB
││各种IC封装形式图片及简称.rar 1.05 MB
││各种封装形式.rar 11.08 KB
││光电子封装--制造的新纪元.rar 22.16 KB
││集成电路封装知识.rar 260.74 KB
││晶片倒贴装技术.pdf 153.99 KB
││晶圆制造与封装.rar 323.97 KB
││可靠性技术彰显威力，高速电路难题迎刃而解.rar 89.76 KB
││破坏物理分析技术的应用.rar 25.10 KB
││微機電產業關鍵成功要素.rar 200.15 KB
││微电子封装基础-Training material.rar 4.21 MB
││微电子封装及微连接.rar 7.10 MB
││微电子与集成电路.rar 1.07 MB
││微電子技術導論.rar 828.21 KB
││新型微电子封装技术.rar 40.47 KB
││转注成型封装材料.rar 1.84 MB
│├─期刊论文 (5 folders, 0 files, 0 bytes, 155.22 MB in total.)
││├─MEMS (0 folders, 31 files, 9.29 MB, 9.29 MB in total.)
│││A Mechanical Approach to Overcome RF MEMS Switch Stiction Problem.pdf 284.32 KB
│││Analytical Simulation of a 1D Single Crystal Silicon Electrostatic Micromirror.pdf 139.64 KB
│││ANSYS FEA of MEMS Switch.pdf 709.37 KB
│││Development of CAD Model for MEMS Micropumps.pdf 140.66 KB
│││Electro-Mechanical Transducer for MEMS Analysis in ANSYS.pdf 168.45 KB
│││finite element based reduced order modeling of MEMS.pdf 129.19 KB
│││Hybrid Finite Element - Trefftz Method for Open Boundary Analysis.pdf 23.15 KB
│││Hybrid P-Element and Trefftz Method for Capacitance Computation.pdf 184.57 KB
│││Investigate the reliability of electrostatic comb-drive actuator utilized in microfludic and space systems using FEA.pdf 777.23 KB
│││maloratsky_micostrip.pdf 126.14 KB
│││mehner_rom144.pdf 681.83 KB
│││mems-solutions-1.pdf 919.24 KB
│││mems-solutions-2.pdf 831.71 KB
│││mems-solutions-3.pdf 205.01 KB
│││mems-solutions-4.pdf 145.00 KB
│││mems-solutions-fall-01-m3.pdf 97.88 KB
│││mems-solutions-spring-01-m1.pdf 87.49 KB
│││mems-solutions-summer-01-m2.pdf 91.98 KB
│││mems-thermal-analogy-fsi-damping.pdf 228.35 KB
│││modeling approach for CVD-diamound based mechanical structures.pdf 137.09 KB
│││Modeling of the Piezoelectric Micropump for Improving the Working Parameters.pdf 94.41 KB
│││Numerical And Analytical Modeling Of The Piezoelectric Transformer And Experimental Verification.pdf 140.95 KB
│││Numerical simulations of flat-walled diffuser elements for valveless micropumps.pdf 439.26 KB
│││PZT ACTUATED MICROMIRROR FOR NANO-TRACKING OF LASER BEAM FOR HIGH-DENSITY OPTICAL DATA STORAGE.pdf 218.01 KB
│││Q-Optimized Lateral Free-Free Beam Micromechanical Resonators.pdf 120.76 KB
│││Quality based design and design for reliablity of micro electro mechanical systems using probabilistic methods.pdf 146.30 KB
│││simple APDL implementation of a 3D FEM simulator for mutual capacitances of arbitrarily shaped objects like interconnects.pdf 455.80 KB
│││STRUCTURAL MODELING AND PROBABILISTIC CHARACTERIZATION OF MEMS pressure sensor.pdf 572.83 KB
│││Triangle Transducer for micro electro mechanical system simulation in ansys program.pdf 886.96 KB
│││using a heat transfer analogy to solve for squeeze film damping and stiffness coefficient in mems structures.pdf 228.35 KB
│││What are microsystems.rar 98.68 KB
││├─分层 (0 folders, 28 files, 29.86 MB, 29.86 MB in total.)
│││A Predictive Methodology for Delamination Growth in Laminated Composites Part II Analysis,Applications, and Accuracy.pdf 5.24 MB
│││Berechnung fortschreitender Risse in Laminaten.pdf 407.54 KB
│││Characteristic dimensions and the micro-mechanisms of fracture and fatigue in ‘nano’ and ‘bio’ materials.pdf 688.57 KB
│││Characterization of chip scale packaging materials.pdf 330.10 KB
│││Contributions of advective and diffusive oxygen transport through multilayer composite caps over mine waste.pdf 1.16 MB
│││Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration.PDF 3.29 MB
│││Dissimilar Material Joints With and Without Free-edge Stress Singularities.pdf 201.69 KB
│││Effect of Packaging on Interfacial Fracture in CuLow k Damascene Structures.pdf 259.82 KB
│││Finite element analyses of mode I interlaminar delamination in z-fibre reinforced composite laminates.pdf 530.01 KB
│││FINITE ELEMENT ANALYSIS OF A FUEL CELL MEMBRANE-ELECTRODE ASSEMBLY UNDER COMPRESSION.pdf 128.84 KB
│││Finite Element Analysis of Stress Distributions in Interconnect Structures.pdf 46.09 KB
│││FLIP CHIP PBGA SOLDER JOINT RELIABILITY POWER CYCLING VERSUS THERMAL CYCLING.pdf 559.30 KB
│││Fracture of SkinStiffener Intersections in Composite Wind Turbine Structures.pdf 581.74 KB
│││Fracture Toughness of Through-Thickness Reinforced Composites.pdf 226.50 KB
│││HIGH-CYCLE FATIGUE IN MICRON-SCALE STRUCTURAL FILMS OF POLYCRYSTALLINE SILICON A REACTION-LAYER FAILURE MECHANISM.pdf 7.11 MB
│││Lead-Free Wave-Soldering and Reliability of Light-Emitting Diode (LED) Display Assemblies.pdf 1.97 MB
│││MICROMECHANISMS AND MECHANICS OF DAMAGE AND FRACTURE IN THIN FILMSUBSTRATE SYSTEMS.pdf 402.62 KB
│││Modeling of Diffusion Through Optical Fiber Coatings.pdf 166.30 KB
│││Moisture Diffusion through a Corrugated Fiberboard under Compres-sive Loading Its Deformation and Stiffness Response.pdf 95.77 KB
│││NUMERICAL MODELING AND ANALYSIS OF PLAIN CONCRETE NOTCHED BEAMS BY MEANS OF FRACTURE MECHANICS.pdf 317.33 KB
│││On The Mechanism of Fatigue in Micron-Scale Structural Films of Polycrystalline Silicon.PDF 2.27 MB
│││Optimization design and residual thermal stress analysis of PDC functionally graded materials.pdf 389.18 KB
│││Reliability of Interface under Accelerated Temperature Cycling.pdf 887.36 KB
│││SOLDER LIFE PREDICTION IN A THERMAL ANALYSIS SOFTWARE ENVIRONMENT.pdf 623.90 KB
│││The research of the random component of air flow velocity in the cylinder of the internal combustion engine.pdf 270.73 KB
│││The Thermo-mechanical Effect of Different Components on Taped Ball Grid Array (TBGA) Package.pdf 521.81 KB
│││Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint Specimen.pdf 879.58 KB
│││Three-Dimensional Progressive Damage Analysis of Composite Joints.pdf 517.28 KB
││├─热分析 (0 folders, 10 files, 10.78 MB, 10.78 MB in total.)
│││Analysis of thermally enhanced SOIC packages.pdf 1.64 MB
│││Analysis of thermally-enhanced SOIC packages.pdf 920.26 KB
│││Asymptotic thermal analysis of electronic packages and printed-circuit boards.pdf 693.13 KB
│││Design and Performance of a System for VLSI Packaging Thermal Modeling and Characterization.pdf 1.35 MB
│││System in a Package Solution for DC-DC Converters David Bolognia, Senior Product Manager.pdf 2.52 MB
│││Thermal analysis of integrated circuit devices and packages.pdf 886.58 KB
│││Thermal enhancement of IC packages.pdf 1.00 MB
│││Thermal enhancement of plastic IC packages.pdf 1.12 MB
│││Transient thermal analysis of an ACF package assembly process.pdf 378.67 KB
│││Transient two-dimensional thermal analysis of electronic packages by the boundary element method.pdf 356.75 KB
││├─外文 (0 folders, 105 files, 63.83 MB, 63.83 MB in total.)
│││A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP).pdf 439.05 KB
│││A Dynamic Thermal Management Circuit for System-On-Chip Designs.pdf 137.40 KB
│││A NEW STRUCTURAL MATERIAL BY ARCHITECTURAL DEMAND.pdf 154.74 KB
│││a practical and reliable method for detection of nanosecond intermittency.pdf 1.53 MB
│││A SIMPLIFIED CFD MODEL FOR THE RADIAL BLOWE.pdf 375.20 KB
│││Accelerate Interconnect reliability Test.pdf 469.48 KB
│││Adaptive Chip-Package Thermal Analysis for Synthesis and Design.pdf 394.81 KB
│││advanced_power_electronics_thermal_mgmt.pdf 254.96 KB
│││An Investigation of Thermal Enhancement of MPM BGA Package.pdf 502.99 KB
│││ANALYSIS AND TESTING OF GRAPHITEEPOXY CONCRETE BRIDGE UNDER STATIC LOAD.pdf 865.00 KB
│││analysis of thermal transient data with synthesized dynamic models for semiconductor devices.pdf 402.43 KB
│││anand 模型的获得.pdf 351.89 KB
│││anand 中文模型获得 现行拟合.pdf 146.41 KB
│││anand2.pdf 369.83 KB
│││Application of thermoacoustic engines to heat transfer in microcircuits.pdf 191.18 KB
│││Bonding pad resistance. A combined approach..pdf 365.33 KB
│││CAD Computer-Aided Design Tools.pdf 81.37 KB
│││CAD-based Methods for Thermal Modeling of Coolant Loops and Heat Pipes.pdf 187.80 KB
│││CAE tool for opt. dev. of switched mode power supplies.pdf 157.07 KB
│││CHAPTER 3 FREE EDGE STRESS GRADIENT ZONES.pdf 278.39 KB
│││CHAPTER 5 MICRO-STRESS FIELD ANALYSIS.pdf 614.41 KB
│││Chip-scale networks Power and thermal impact.pdf 288.01 KB
│││Choosing The Right Power MOSFET Package.pdf 154.10 KB
│││Close the Information Gap on IC package Reliability 1.pdf 29.97 KB
│││COMPONENT SIZE AND EFFECTIVE THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS.pdf 571.92 KB
│││COMPUTATION FOR MICROMACHINE DESIGN.pdf 381.48 KB
│││Connector Reliability Testing.pdf 828.17 KB
│││CSC REPORT ON SCIENTIFIC COMPUTING 2001–2003.pdf 3.14 MB
│││DESIGN OPTIMIZATION OF AN EDDY CURRENT SENSOR USING THE FINITE-ELEMENTS METHOD.pdf 261.84 KB
│││DEVELOPMENT OF A DRY WALL CONCEPT FOR LASER IFE CHAMBERS.pdf 257.23 KB
│││Development of a New Improved High Performance Flip Chip BGA Package.pdf 673.35 KB
│││DROP TEST AND IMPACT LIFE PREDICTION MODEL FOR QFN PACKAGES.pdf 420.79 KB
│││Dynamic Thermal Characterization and Modeling of Packaged AlGaAsGaAs HBT’s.pdf 173.23 KB
│││EFFECT OF RESIDUAL STRESS IN LAYERS OF ARTICULAR CARTILAGE UNDER DYNAMIC LOADING.pdf 297.89 KB
│││EFFICIENT THERMAL SIMULATION FOR RUN-TIME TEMPERATURE TRACKING AND MANAGEMENT.pdf 176.26 KB
│││Electrical and thermal modeling of the non-Ohmic differential conductance in a tunnel junction containing a pinhole.pdf 105.37 KB
│││Evaluation of Airflow Prediction Methods in Compact Electronic Enclosures.pdf 118.63 KB
│││Experimental Techniques for Measuring Temperature and Velocity Fields to Improve the Use and Validation of Building Heat Transfer Models.pdf 563.42 KB
│││Experimental Validation Methods for Thermal Models.pdf 673.24 KB
│││FABRICATION AND ANALYSIS OF PLASTIC HYPODERMIC NEEDLES.pdf 458.08 KB
│││Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages.pdf 109.47 KB
│││Fatigue Crack Initiation Life Prediction for a Flat Plate with a center hole.pdf 201.22 KB
│││Fatigue of reinforced-polyurethane-based, sheet metal forming dies.pdf 336.39 KB
│││Finite Element Modeling Predicts Possibility of Thermoelectrically-Cooled Lead-Salt Diode Lasers.pdf 47.99 KB
│││Fully Analytical Compact Thermal Model of Complex Electronic Power Devices and Packages in Coupled Electrothermal CAD.pdf 919.84 KB
│││Guest Editors’ Introduction Big Innovations in Small packages.pdf 50.50 KB
│││IC Packaging and Input - Output Signals.pdf 1.55 MB
│││Impacts of Lead-Free Soldering on Wafer-Level Chip Scale Packages.pdf 8.24 MB
│││Improving accuracy in heat flux measurements.doc 69.00 KB
│││Investigation of Electrode Material Mechanics.pdf 2.53 MB
│││investigation of solder fatigue acceleration factors.pdf 668.67 KB
│││Lead Bending and Soldering Considerations for International Rectifier’s Power Semiconductor Packages .pdf 104.72 KB
│││Mechanical modelling of wood microstructure, an engineering approach.pdf 371.50 KB
│││microsystems-technology-standardisation-roadmap.pdf 1.36 MB
│││Modeling a MEMS Thermal Conductivity Pressure Sensor for the Evaluation of Glass Frit Vacuum Packaging.pdf 332.49 KB
│││Nano Engineered Fire Resistant Composite Fibers.pdf 1.16 MB
│││PA CKA GE DEALS.pdf 142.95 KB
│││PACKAGE_THERMAL_CHARACTERIZATION-MISC.pdf 78.54 KB
│││PARAMETRIC THERMAL MODELING OF 3D STACKED CHIP ELECTRONICS WITH INTERLEAVED SOLID HEAT SPREADERS.pdf 59.77 KB
│││PCB-integrated metallic thermal micro-actuators.pdf 364.16 KB
│││Philips Semiconductors TDA8002C_3.pdf 149.68 KB
│││Physically-Based Compact Thermal Modeling — Achieving Parametrization and Boundary Condition Independence.pdf 266.22 KB
│││PLASTIC_PACKAGE_MOISTURE-INDUCED_CRACKING.pdf 478.36 KB
│││Prediction of Microelectronics Thermal Behavior in Electronic Equipment Status, Challenges and Future Requirements.pdf 384.72 KB
│││PZFlex_Capabilities—FEM packages.pdf 416.62 KB
│││RAPID, LOW-COST FABRICATION OF PARYLENE MICROCHANNELS FOR MICROFLUIDIC APPLICATIONS.pdf 1.41 MB
│││Recent Advancement in the Thermal Design of Electric Motors.pdf 2.81 MB
│││REDUCED HUMAN FATIGUE INTERACTIVE EVOLUTIONARY COMPUTATION FOR MICROMACHINE DESIGN.pdf 809.26 KB
│││REFINED STRENGTH AND LIFE ANALYSIS OF FRP BEAMS.pdf 323.35 KB
│││RELIABILITY ANALYSIS OF BGA PACKAGES – A TOOL FOR DESIGN ENGINEERS.pdf 440.01 KB
│││Reliability Modelling of Embedded System-in-a-Package.pdf 569.43 KB
│││reliability of lead-force solder materials for ic packaging.pdf 664.19 KB
│││semiconductor device thermal testing.doc 79.00 KB
│││Semiconductor IC Packaging Technology Challenges.pdf 230.53 KB
│││Semiconductor Package Synthetic Models Provide.ppt 1.13 MB
│││Sensitivity Evaluation on Sphere Attachment Shear Strength.pdf 146.31 KB
│││Solder Joint Design For Reliability.pdf 150.71 KB
│││StreamlinedThermal Modeling.pdf 66.41 KB
│││Surface Engineering of Polycrystalline Silicon Microelectromechanical Systems for Fatigue Resistance.PDF 443.31 KB
│││Technical Basis Document No. 6 Waste Package and Drip Shield Corrosion.pdf 8.03 MB
│││The Engineering, Design, and Fabrication Facility A Unique APL Resource.pdf 1.24 MB
│││The Need for a FullChip Thermally Optimized IC Designs.pdf 1.03 MB
│││Thermal and Structural Analysis of the TPX Divertor.pdf 49.21 KB
│││Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package.pdf 350.89 KB
│││thermal design consideration for luxeon 5 watt power light source.pdf 405.74 KB
│││Thermal Design Considerations—EL75XX.pdf 194.66 KB
│││Thermal Measurement Methodology of RF Power Amplifiers.pdf 248.58 KB
│││Thermal Modeling and Imaging of As-built Vehicle Components.pdf 461.09 KB
│││Thermal Modeling of Aluminum Electrolytic Capacitors.pdf 102.95 KB
│││Thermal Modeling of Cryogenic Accelerator Structures.pdf 309.75 KB
│││Thermal Modeling of Microgravity Experiments.pdf 398.50 KB
│││Thermal Modeling of Power-electronic Systems.pdf 402.01 KB
│││Thermal Modeling, Analysis and Management in VLSI Circuits Principles and Methods.pdf 252.58 KB
│││Thermal Modeling, Characterization and Management of On-chip Networks.pdf 798.16 KB
│││Thermal transient characterization methodology for single-die and stacked structures.pdf 342.36 KB
│││THERMAL-RESISTANCE OF IC Package.pdf 119.92 KB
│││Thermomechanical Optical Attenuator.pdf 574.50 KB
│││Time Dependent Behaviour of Piezo-Electric Materials.pdf 358.35 KB
│││TOWARDS UNDERGRADUATE EDUCATION IN SYSTEMS HARDWARE TECHNOLOGIES.pdf 138.51 KB
│││tsop.pdf 245.80 KB
│││Using Kinetic Models to Predict Thermal Degradation of Fire-Retardant-Treated Plywood Roof Sheathing.pdf 241.56 KB
│││Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications.pdf 433.35 KB
│││多晶片模組可靠性及可繞性擺置法之研究.pdf 64.95 KB
│││复合材料结构弹脆塑性力学行为数值研究.pdf 168.00 KB
│││散熱分析對BGA 封裝模型可靠度的影響.pdf 43.74 KB
││└─中文 (0 folders, 84 files, 41.45 MB, 41.45 MB in total.)
││Bumpless Build-UpLayer 封装.pdf 484.72 KB
││circuit_design19.pdf 146.66 KB
││CMOS-MEMS 製程技術與電腦輔助微機電系統設計.pdf 6.63 MB
││FC-PBGA 之熱流模擬簡介.pdf 1.60 MB
││IC 智能卡失效机理研究.pdf 191.07 KB
││Icepak 薄板元件在IC 封裝上的新應用.pdf 367.38 KB
││ILB TCP Thermal-mechanical analysis_IM.pdf 2.96 MB
││LED China.pdf 1.09 MB
││LED论文集.pdf 1.81 MB
││MEMS封装可靠性测试规范.pdf 154.21 KB
││NUMERICAL MODELING OF A SLUSHFLOW EVENT.pdf 386.88 KB
││Package Thermal Characteristics.pdf 65.72 KB
││Parameterized Physical Compact Thermal Modeling.pdf 428.97 KB
││PCB 焊点可靠性问题的理论和实验研究进展.pdf 179.53 KB
││PCB焊点可靠性问题的理论和实验研究进.pdf 179.53 KB
││Polymer-MEMS 及其微流體生醫晶片之應用.pdf 1.34 MB
││RTP公司的高性能熱塑性塑膠.pdf 261.56 KB
││SL 快速成型件变形的等效力学模型分析.pdf 91.40 KB
││對偶邊界元素法在疲勞破壞之工程應用.pdf 185.08 KB
││應用準確白光相移技術於BGA 共平面之檢測.pdf 13.71 KB
││應用不同影像量化法於電子構裝熱變形量測之系統設計.pdf 262.47 KB
││“封装工艺员”课程详细介绍.pdf 94.62 KB
││板厚影响通孔再流焊点抗热疲劳性能的.pdf 125.91 KB
││板类构件内部残余应力测试技术研究.pdf 135.78 KB
││表面粗糙度对于微结构粘附的影响分析.pdf 198.84 KB
││冰箱试验包传热过程的仿真计算.pdf 120.22 KB
││彩色機器視覺在BGA 鍍金區瑕疵偵測與分類上的應用.pdf 415.31 KB
││单板层积材热效应的表征.pdf 114.14 KB
││倒装焊sn_pb焊点的热疲劳失效.pdf 211.60 KB
││第12組_轉注成型電子封裝.pdf 656.37 KB
││第五章平面顯示器.pdf 2.10 MB
││典型的密封式电子设备结构热设计研究.CAJ 41.33 KB
││电子电气用工程塑料应用发展趋势.pdf 92.81 KB
││电子封装功率模块PbSnAg 焊层热循环可靠性.pdf 141.01 KB
││电子封装和组装中的微连接技术.pdf 129.41 KB
││电子封装和组装中的微连接技术0.pdf 129.41 KB
││电子封装失效分析技术.pdf 1.03 MB
││多道焊三维残余应力场有限元模拟.pdf 281.27 KB
││非对称压电层合板的热效应.pdf 195.87 KB
││覆晶式塑封球柵陣列熱系統分析.pdf 530.00 KB
││复杂环境下的三维疲劳断裂.pdf 242.70 KB
││钢渗硼表面残余应力数值模拟.pdf 221.81 KB
││高密度多重埋孔印制板的设计与制造.pdf 221.49 KB
││高密度封装温度研究.pdf 140.67 KB
││高温SiC基电子组件的封装.pdf 44.57 KB
││各向异性导电胶粘接可靠性研究进展s.pdf 87.73 KB
││国内外无铅焊料专利发展概况.pdf 398.36 KB
││含埋藏裂纹焊接结构可靠性分析.pdf 47.34 KB
││混合封装电力电子集成模块内的传热研究.pdf 121.24 KB
││混凝土鋪面版之角隅荷重與翹曲應力分析.pdf 68.19 KB
││基于ANSYS软件二次开发的铸造充型和凝固耦合过程数值模拟研究.caj 48.99 KB
││基于ANSYS上的焊接热过程模拟技术的研究.caj 35.50 KB
││基于全面析因试验的塑封球栅阵列器件焊点可靠性.pdf 239.50 KB
││集成式计算机芯片水冷系统的研究.pdf 158.31 KB
││網路攝影機外殼之製程最佳化.pdf 360.36 KB
││晶元封裝三維有限分析.pdf 276.47 KB
││颗粒增强基复合材料屈服行为研究.pdf 240.06 KB
││软性基板之封装可靠性.pdf 1.01 MB
││散热能力.pdf 628.82 KB
││使用自動模組化元件來產生IC 封裝模型.pdf 21.98 KB
││塑料封装器件塑料界面分层失效分析.pdf 115.87 KB
││通孔元件再流焊点的抗热疲劳性能预测（Ⅰ）.pdf 598.55 KB
││通孔元件再流焊点的抗热疲劳性能预测（Ⅱ）.pdf 757.71 KB
││微电子封装互连焊点的可靠性.pdf 886.47 KB
││微电子封装与组装中的再流焊技术研究进展.pdf 151.49 KB
││微电子无铅锡焊可靠性.pdf 242.41 KB
││无铅焊可靠性.pdf 1.03 MB
││无铅化挑战的电子组装与封装时代.pdf 130.62 KB
││无线技术中堆栈裸芯封装.pdf 108.34 KB
││吸水过程对环氧树脂的动态松弛行为的影响.pdf 192.38 KB
││先進微電子封裝中錫銀銅銲料與金鎳表面處理層之界面反應.pdf 1.56 MB
││芯片叠层封装的失效分析和热应力模拟.pdf 139.63 KB
││芯片验证测试及失效分析1.pdf 243.56 KB
││新式堆疊封裝結構之熱傳模擬分析.rar 100.50 KB
││压渗SiCp Al 电子封装复合材料的研究.pdf 605.85 KB
││以電漿聚合技術對電子構裝軟性基板改質於表面及界面性質影響之研究.pdf 146.05 KB
││印刷電路板產業現況與展望.pdf 563.96 KB
││应用异方形导电胶与电子构装热行为分析.pdf 256.97 KB
││智能结构系统——梦想、现实与未来.pdf 374.91 KB
││邊界元素法分析電子構裝之層面熱應力.pdf 1.13 MB
││電子業之環保策略.pdf 319.18 KB
││電子構裝熱音波銲接金線製程研究.pdf 427.80 KB
││電子構裝中重要性漸起的IC載板產業.pdf 106.35 KB
││電子散熱及系統熱源管理.pdf 1.47 MB
│├─软件教程 (4 folders, 32 files, 22.80 MB, 83.54 MB in total.)
│││ANSYS FAQs.pdf 337.80 KB
│││[经典]Modeling the fatigue crack growth and propagation life of a joint.pdf 393.81 KB
│││ansys mpc.pdf 276.68 KB
│││ansys8.1并行计算指南.pdf 536.59 KB
│││Ansys_线性和非线性结构静力分析指南.pdf 1.36 MB
│││ANSYS_优化设计.pdf 262.64 KB
│││ANSYS帮助中疲劳一章的翻译.pdf 235.39 KB
│││ansys处理粘结问题.rar 139.65 KB
│││ANSYS电磁场.rar 6.63 MB
│││ANSYS分析实例与工程应用.rar 97.35 KB
│││ANSYS基于VC++6[1].0的二次开发与相互作用分析在ANSYS中的实现.rar 10.96 KB
│││ANSYS接触元素之使用与验证.rar 190.48 KB
│││ANSYS梁单元的理论基础及其选用方法.PDF 186.14 KB
│││ANSYS命令整理.rar 230.93 KB
│││ANSYS优化设计.rar 1.23 MB
│││ansys中文教程.rar 1.32 MB
│││flotran.pdf 72.41 KB
│││HFSS8.0中文培训教程.pdf 628.71 KB
│││HFSS使用经验.pdf 155.50 KB
│││HFSS使用心得.pdf 22.74 KB
│││HIERARCHICAL MODULAR MODELLING IN DISCRETE SIMULATION.pdf 196.20 KB
│││MATLABI与ANSYS的连接.pdf 148.21 KB
│││NASTRAN温度场分析资料.rar 187.48 KB
│││patran技巧及其常见问题 Patran FAQs and TIPs.pdf 176.93 KB
│││ProE高级曲面.pdf 606.30 KB
│││ProE野火入门.pdf 4.14 MB
│││经理主管决策人员需要知道的有限元素分析.pdf 31.25 KB
│││疲劳分析中的雨流计数法.pdf 109.79 KB
│││数学公式的英语读法.pdf 83.00 KB
│││微機電設計模擬軟體Coventorware Introduction.PDF 2.49 MB
│││一个法国牛人的射频培训资料.rar 253.64 KB
│││有限元的单位.pdf 182.68 KB
││├─ANSYS Manual (0 folders, 3 files, 12.43 MB, 12.43 MB in total.)
│││PTDUsersManual10.rar 3.86 MB
│││TASPCBUsersManual10.rar 4.50 MB
│││TASUsersManual10.rar 4.08 MB
││├─ANSYS Solutions (0 folders, 13 files, 5.92 MB, 5.92 MB in total.)
│││ansys-ptd.pdf 240.79 KB
│││cfx-transition-mod.pdf 452.65 KB
│││electromagnetics-solution-10.pdf 217.47 KB
│││electronics-industry.pdf 531.44 KB
│││ion-dynamics.pdf 206.15 KB
│││mems-solutions-1.pdf 919.24 KB
│││microsystems and Nanotechnology-spotlight-sum05.pdf 170.76 KB
│││multiphysics-solution-10.pdf 219.89 KB
│││multiphysics_analysis.pdf 426.56 KB
│││semiconductor analysis-spotlight-win06.pdf 0.96 MB
│││tools for mems.pdf 329.07 KB
│││wp_eaton.pdf 88.39 KB
│││wp_ews.pdf 1.24 MB
││├─ANSYS Thermal (1 folders, 3 files, 6.45 MB, 38.51 MB in total.)
││││Qb热分析[120'].rar 1.78 MB
││││热分析完整PPT.rar 4.28 MB
││││热应力.pdf 402.24 KB
│││└─PTD&TAS Manual (0 folders, 6 files, 32.05 MB, 32.05 MB in total.)
│││PTDUsersManual10.pdf 6.23 MB
│││PTDUsersManual10.rar 3.86 MB
│││TASPCBUsersManual10.pdf 7.08 MB
│││TASPCBUsersManual10.rar 4.50 MB
│││TASUsersManual10.pdf 6.30 MB
│││TASUsersManual10.rar 4.08 MB
││└─Mesh Tech (0 folders, 6 files, 3.88 MB, 3.88 MB in total.)
││Patran相贯划分网格教程.pdf 2.11 MB
││hypermesh5_day1.pdf 576.70 KB
││hypermesh5_day2.pdf 848.14 KB
││金属塑性成形有限元六面体网格自动生成方法及优化技术.pdf 219.25 KB
││六面体单元生成方法及相关技术.pdf 168.96 KB
││有限元网格划分的基本原则.txt 5.49 KB
│├─散热设计 (0 folders, 25 files, 7.09 MB, 7.09 MB in total.)
││Advanced Thermal Architecture for Cooling of High Power Electronics.rar 228.83 KB
││IGBT-06-散热设计方法.rar 467.94 KB
││Innovative heatsink Enables hot uplinkls.rar 171.86 KB
││mcm热设计方法.rar 8.58 KB
││PACKAGE_THERMAL_CHARACTERIZATION-MISC.rar 62.78 KB
││pc散热综述.rar 11.34 KB
││Performing Thermal Analysis in System.rar 1.34 MB
││SMT印制电路板热设计探讨.rar 8.93 KB
││The following discussion is a brief introduction to the technical fundamentals of semiconductor device thermal testing using the electrical method of junction temperature measurement.rar 61.54 KB
││The Improvement of Thermal Modeling Accuracy of Electronic Packages.rar 306.52 KB
││Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package.rar 341.05 KB
││Thermal Characterization of Packaged.rar 141.35 KB
││UNDERSTANDING_INTERGRATED_CIRCUIT_PACKAGE_POWER_CA.rar 159.22 KB
││Why Is My DC-DC Converter Too Hot.rar 1.65 MB
││應用Icepak於TBGA封裝之熱設計可靠度分析之研究.rar 737.37 KB
││熱傳導係數測定實驗.rar 70.34 KB
││表面组装器件热设计.rar 8.12 KB
││大功率半导体器件主要参数介绍.rar 161.75 KB
││大功率电源模块的散热设计.rar 44.23 KB
││电子产品的热设计方法.rar 22.50 KB
││封装散热技术.rar 501.79 KB
││开关电源设计步骤.rar 27.81 KB
││如何计算散热器的散热功率.rar 70.71 KB
││手機等電子產品的熱設計方法.rar 17.12 KB
││電子元件散熱片研究規劃.rar 571.44 KB
│├─数理基础 (0 folders, 19 files, 21.56 MB, 21.56 MB in total.)
││CSP封裝產品在循環熱應力下之可靠度分析PPT.rar 658.70 KB
││LOC IC構裝之晶粒破裂分析PPT.rar 468.76 KB
││传 热.rar 1.18 MB
││弹 塑 性 力 学PPT.rar 858.25 KB
││导 热.rar 405.89 KB
││第三章 直梁的弯曲PPT.rar 1.65 MB
││电子封装力学PPT.rar 39.63 KB
││高聚物粘弹性力学模型中值得探讨的几个问题PPT.rar 245.41 KB
││固体力学概论PPT.rar 393.99 KB
││光电技术PPT.rar 4.14 MB
││宏观尺度材料设计 有限元方法PPT.rar 148.30 KB
││金属的断裂PPT.rar 2.47 MB
││金属塑性加工原理PPT.rar 1.79 MB
││理论力学PPT.rar 1.11 MB
││流体力学.rar 0.99 MB
││流体力学PPT.rar 222.79 KB
││热力学统计力学PPT.rar 2.41 MB
││物理学PPT.rar 974.22 KB
││现代固体力学与材料PPT.rar 1.50 MB
│└─学位论文 (19 folders, 1 files, 3.13 MB, 195.85 MB in total.)
││有限元耦合应力分析.pdf 3.13 MB
│├─MEMS系统 (0 folders, 5 files, 7.31 MB, 7.31 MB in total.)
││Design_Fabrication_and_Modeling_of_Magnetic_Microelectromechanical_System_MEMS_Components.pdf 2.79 MB
││入口气体流速及压力对弯曲微流到之寿命影响.pdf 421.25 KB
││射频(RF) MEMS开关的模拟、制备和力学分析.pdf 2.03 MB
││微镜扭转-弯曲耦合变形静态特性分析.pdf 99.26 KB
││靜電式半球狀微聚焦調變鏡之設計分析与制作.pdf 1.98 MB
│├─参数模型 (0 folders, 2 files, 1.88 MB, 1.88 MB in total.)
││轿车ANSYS参数化分析模型的构造研究及应用.pdf 799.16 KB
││座椅被动安全性仿真分析与结构参数化设计.pdf 1.10 MB
│├─残余应力 (0 folders, 7 files, 22.57 MB, 22.57 MB in total.)
││IC 8L SOTSP导线架残余应力和回弹研究.pdf 4.58 MB
││IC封装塑胶残余应力理论与分析.pdf 4.14 MB
││ILB TCP Thermal-mechanical analysis_IM.pdf 2.96 MB
││PBTGF 射出成型製程最佳化及挫屈特性研究.pdf 2.21 MB
││應用CADCAECAM 技術於塑膠射出成型.pdf 6.01 MB
││建立在硅基板上的埋藏式高分子波导.pdf 488.67 KB
││轉注成型封裝材.pdf 2.19 MB
│├─电热耦合 (0 folders, 1 files, 2.22 MB, 2.22 MB in total.)
││electro-thermal modeling of a powerelectronic moudule.pdf 2.22 MB
│├─复合材料 (0 folders, 5 files, 18.36 MB, 18.36 MB in total.)
││A Predictive Methodology for Delamination Growth in Laminated Composites Part II Analysis, Applications, and Accuracy Assessment.pdf 5.24 MB
││Effects of Interlaminar Stress Gradients on Free Edge Delamination in Composite Laminates.pdf 6.37 MB
││Strength and Fatigue Life Prediction for a Composite Structural Beam.pdf 2.65 MB
││The Impact Response of Composite Materials Involved in Helicopter Vulnerability Assessment.pdf 1.20 MB
││复合材料静水挤压加工.pdf 2.89 MB
│├─化学工程 (0 folders, 2 files, 2.58 MB, 2.58 MB in total.)
││含有烯基侧链的芳香族二胺及其衍生之聚硫亚胺的合成性质研究.pdf 1.36 MB
││热处理对聚炳烯晴中空纤维参透蒸发分离效能的研究.pdf 1.22 MB
│├─界面分层 (0 folders, 5 files, 6.94 MB, 6.94 MB in total.)
││Failure Criteria and their Application to Visco-ElasticVisco-Plastic Materials.pdf 105.36 KB
││Sensitivity Analysis of Interface Fatigue Crack Propagation in Elastic Composite Laminates.pdf 2.51 MB
││含缺口碳纤维-聚醚醚酮复合材料积层板之疲劳破坏研究.pdf 1.23 MB
││塑胶球栈阵列封装界面热机械特性研究.pdf 1.93 MB
││芯片封装之粘结力测试与分析.pdf 1.17 MB
│├─经济管理 (0 folders, 6 files, 4.31 MB, 4.31 MB in total.)
││朝阳科技大学-应用6西格马方法改善涂装制造不良率.pdf 1.77 MB
││国立中山大学论文-微利时代半导体封装测试业的竞争策略.pdf 638.80 KB
││台湾手机产业嵌入式软体需求与机会.pdf 528.26 KB
││芯片封装业核心能力构建模式.pdf 371.65 KB
││员工分红入股制度对高科技产业发展之影响.pdf 578.98 KB
││资源技术与产业-工业技术研究院模式分析.pdf 482.35 KB
│├─疲劳强度 (0 folders, 5 files, 19.47 MB, 19.47 MB in total.)
││EFFECT OF INTERMETALLIC COMPOUNDS ON THERMOMECHANICAL RELIABILITY OF LEAD-FREE SOLDER INTERCONNECTS FOR FLIP-CHIPS.pdf 6.28 MB
││国立成功大学芯片封装论文[40].pdf 1.89 MB
││焊接接头疲劳寿命评估.pdf 7.85 MB
││晶片级封装之可靠性分析[47].pdf 1.63 MB
││数值模拟覆晶粒尺寸之疲劳可靠性问题[45].pdf 1.82 MB
│├─破坏分析 (0 folders, 3 files, 8.77 MB, 8.77 MB in total.)
││Study of Interfacial Crack Propagation In Flip Chip Assemblies With Nano-Filled Underfill Materials_200508_phd.pdf 3.36 MB
││电子构装之破坏力学分析[54].pdf 1.73 MB
││晶片层级界面之结合强度与破坏韧度.pdf 3.68 MB
│├─翘曲分析 (0 folders, 10 files, 16.57 MB, 16.57 MB in total.)
││CFD与模流分析在薄式电子封装中的设计与分析.pdf 2.14 MB
││PBTGF 射出成型製程最佳化及挫屈特性研究.pdf 2.21 MB
││壁纸级加热翘曲及变形分析.pdf 1.15 MB
││覆晶封装之热应力与翘曲分析[50].pdf 1.77 MB
││覆晶在熱壓合製程中之結構分析及性能改善.pdf 3.06 MB
││光电二极管IMC层应力分析.pdf 0.97 MB
││台湾论文-湿度所引起的封装翘曲分析及测试.pdf 906.90 KB
││微型球栈阵列封装翘曲及热应力分析[41].pdf 1.29 MB
││芯片封装元件翘曲分析研究.pdf 2.82 MB
││電子構裝製程中複層基板熱彎曲變形之探討.pdf 280.14 KB
│├─热弹力学 (0 folders, 6 files, 2.42 MB, 2.42 MB in total.)
││應用逆向估測法於二維熱彈性動態問題之研究.pdf 1.09 MB
││熱耦合非均勻彈性圓板之非線性動態管制方程式.pdf 97.82 KB
││冰温度膨胀力的有限元分析.pdf 236.86 KB
││机车刹车碟之热应力分析.pdf 365.31 KB
││结构陶瓷激光加工的热应力分析.pdf 160.31 KB
││热容激光器激光介质的热力学数值模拟.pdf 496.92 KB
│├─散热设计 (0 folders, 4 files, 9.89 MB, 9.89 MB in total.)
││Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power ELECTRIC MODULES.pdf 3.16 MB
││thermal conductivity and specific heat.pdf 4.83 MB
││Thermal Modeling and Management of Discrete Surface Mount Packages.pdf 813.26 KB
││国立成功大学论文（笔记本电脑散热设计研究）.pdf 1.10 MB
│├─射流技术 (0 folders, 3 files, 4.94 MB, 4.94 MB in total.)
││Modeling and Simulation of the Fluidic Controlled Self-Assembly of Micro Parts.pdf 2.61 MB
││Modeling, Simulation,and Experimentation of a Promising New Packaging Technology Parallel Fluidic Self-Assembly of microdevices.pdf 521.92 KB
││Modelling, Simulation and Experimentation of a Promising New Packaging Technology – Paralled Fluidic Self-Assembly of Micro Devices.pdf 1.82 MB
│├─设备工艺 (0 folders, 7 files, 14.96 MB, 14.96 MB in total.)
││表面粘着型发光二极管取放机构的研究.pdf 1.42 MB
││封装制程设备.pdf 2.77 MB
││国立中山大学硕士论文-用于微型组装之微型机械手设计与分析.pdf 2.97 MB
││通用CAIp于基板设计对比.pdf 1.39 MB
││微流动元件制程.pdf 2.68 MB
││微型懸臂式探針卡.pdf 2.33 MB
││粘晶机系统整合与力量控制研究.pdf 1.41 MB
│├─湿气扩散 (0 folders, 1 files, 1.35 MB, 1.35 MB in total.)
││effect of tempretrue and moistrue on durability of low cost flip chip on board assembles.pdf 1.35 MB
│├─新型封装 (0 folders, 2 files, 9.71 MB, 9.71 MB in total.)
││ELECTROPLATED COMPLIANT HIGH-DENSITY INTERCONNECTS FOR NEXT-GENERATION MICROELECTRONIC PACKAGING.pdf 5.27 MB
││High Temperature SiC Embedded Chip Module (ECM) with Double-Sided Metallization Structure.pdf 4.44 MB
│├─压电效应 (0 folders, 2 files, 3.28 MB, 3.28 MB in total.)
││三維壓電致動器微鏡子之設計與製作.pdf 2.02 MB
││压电效应的有限元分析及压电悬置控制方法的研究.pdf 1.26 MB
│└─制程工艺 (0 folders, 13 files, 35.20 MB, 35.20 MB in total.)
│Processes and Characteristic Analysis of GaN MOS Structure.pdf 438.81 KB
│Sink - Stat Model.pdf 1.83 MB
│T性管液压成型自适应模拟.pdf 1.32 MB
│應用CADCAECAM 技術於塑膠射出成型.pdf 6.01 MB
│球栈阵列型构装模流暨热传性能研究.pdf 2.08 MB
│三位电脑辅助工程在模流分析中应用研究.pdf 4.67 MB
│芯片封裝製程之金線偏移與導線架偏移分析-.pdf 3.43 MB
│芯片封裝製程之金線偏移與導線架偏移分析.pdf 67.69 KB
│一种新型微流量计的设计、制备及力学分析.pdf 2.64 MB
│以混成玻璃材料制作单模态之埋藏光波导.pdf 650.52 KB
│中原大学硕士论文-IC制造中的模流分析与金线偏移.pdf 6.58 MB
│中原大学硕士论文-以天口方法改变IC封装制造之金线偏移.pdf 1.37 MB
│鎢酸鋯陶瓷之製作.pdf 4.14 MB
└─upload (2 folders, 7 files, 2.41 MB, 12.44 MB in total.)
│===请勿上传违反国家法律的内容===.txt 602 bytes
│CA11.JPG 45.06 KB
│mficchip.rar 675.67 KB
│msm99_ansys_trans126.pdf 168.45 KB
│scanning.mirrors.bonding.process.JMEMS.pdf 1.30 MB
│代数方程求解方法收敛速度比较及对算法健壮性的影响.pdf 128.68 KB
│一种求解不可压N-S方程的非结构化网格方法.pdf 118.45 KB
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│││超分辨测向中阵元间互耦的校正.pdf 327.29 KB
│││大功率微带滤波器的设计.pdf 109.63 KB
│││带阻及低通微带滤波器的分析与设计.pdf 300.47 KB
│││电磁学名词.doc 110.00 KB
│││干扰合成孔径雷达的统一方程.pdf 750.86 KB
│││干扰条件下雷达探测距离的建模和分析.pdf 186.76 KB
│││合成孔径雷达的特点及其干扰技术.pdf 189.65 KB
│││基于FDTD的宽带微带天线的研究.pdf 545.37 KB
│││基于FDTD的微带缝隙漏波天线分析.pdf 461.90 KB
│││基于FDTD的相控微带天线阵设计与分析.pdf 164.97 KB
│││基于MEMS微带天线带宽和辐射特性的分析研究.pdf 333.49 KB
│││基于单次快拍的自适应天线阵互耦效应分析与校正.pdf 112.04 KB
│││机载有源相控阵天线的结构设计.pdf 195.95 KB
│││极化变换方法及其原理分析.pdf 464.64 KB
│││阶跃阻抗带通微带滤波器的设计仿真与优化.pdf 270.84 KB
│││雷达运动目标回波分析.doc 81.00 KB
│││利用ADS仿真设计低噪声放大器.pdf 756.76 KB
│││连续结构微带滤波器的矩阵运算法分析.pdf 234.53 KB
│││频率捷变雷达有源干扰技术仿真研究.pdf 500.74 KB
│││频谱分析仪——频域测量的最重要工具.pdf 225.16 KB
│││频谱分析仪测量调幅、调频.pdf 210.75 KB
│││频谱分析仪的原理和发展.pdf 95.36 KB
│││平行耦合微带滤波器设计与实现.pdf 262.53 KB
│││微波滤波器的回顾与展望.caj 824.32 KB
│││微波线形功率放大器综述.doc 115.00 KB
│││微波线性相位环状微带滤波器.pdf 131.21 KB
│││微波元器件测量的重要手段：网络分析仪.pdf 57.67 KB
│││微带电路和天线的时域仿真.pdf 726.16 KB
│││微带天线RCS及其减缩.pdf 189.67 KB
│││线性调频脉冲压缩雷达干扰仿真研究.pdf 252.68 KB
│││相控阵雷达的关键技术与物理学的波动知识.pdf 295.03 KB
│││相控阵雷达与光控相控阵雷达.pdf 633.14 KB
│││小型微带带通滤波器的设计.caj 137.67 KB
│││新型毫米波微带带通滤波器.caj 142.91 KB
│││一种EBG微带滤波器的设计.caj 385.46 KB
│││一种新型频率固定相控波束扫描的微带漏波天线.pdf 171.60 KB
│││智能天线微带天线阵列中线阵单元设计.pdf 145.73 KB
│││阻抗加载对微带天线辐射和散射的影响.pdf 191.23 KB
│Physics - Electromagnetic Field Theory (Theory and Problems).rar 2.83 MB
│导线天线的分析与综合.pdf 4.42 MB
│电磁理论（外文）.rar 7.07 MB
│电脑辅助工程分析：ANSYS使用指南.rar 6.22 MB
│反射面天线.pdf 3.38 MB
│金属天线与散射体分析.pdf 6.08 MB
│雷达目标特征信号.rar 9.40 MB
│流体力学有限元－哈工大－杨濯根.rar 2.93 MB
│如何HFFS9中参扫、优化、和灵敏度分析.pdf 839.83 KB
│时域有限差分法(高本庆).pdf 5.14 MB
│实用工程数值模拟技术及其在ANSYS上的实践.rar 5.76 MB
│天线测量.pdf 3.40 MB
│天线基础及应用.rar 259.79 KB
│天线理论基础——任朗.pdf 7.53 MB
│微波技术基础.rar 8.18 MB
│微带天线理论与工程.pdf 5.18 MB
│微带天线理论与应用.pdf 3.43 MB
│卫星通信天线.pdf 4.62 MB
│相控天线阵.pdf 4.46 MB
│小波分析.rar 371.87 KB
[[i] 本帖最后由 51kkk 于 2006-10-20 22:18 编辑 [/i]] 不错，谢谢。
谢谢
象这样不要积分的帮助，越多越好！谢谢 *** 作者被禁止或删除 内容自动屏蔽 *** 打不开111111 可能是线路问题 看上去不错，可是我为什么打不开呢 ？
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